Most semiconductor manufacturers have started producing components with
lead-free interconnects, and are moving completely towards no-lead
products. Details are usually on their web-sites.
Passives are slightly more of a problem, although many now produce
components suitable for no-lead soldering. Some companies such as Rohm
have decided to go lead free globally on all of their products.
Care should be taken with some Japanese components, which have
tin/bismuth coatings which are unsuitable for SN/Cu or SnAgCu soldering
because of the lower melting temperature from the use of bismuth.
For many supplies they will have to essentially double of the part
numbers they have in their portfolio during the change over.
Many component suppliers don't want to change part numbers. There's no
industry spec to identify lead-free parts, though some standards groups
are trying to come up with a universal marking scheme. As an example:
AVX Corp., is retaining the same part numbers for its tin-plated
tantalum capacitors while it phases out tin-lead versions. The reason
given is that the tin-plated parts are fully compatible with existing
vapor-phase or infrared reflow soldering.
Toshiba America Electronic Components Inc has estimated that it will
cost the company $1 million a year for the next several years to
communicate its lead-free roadmap to customers and share reports
regarding qualifications and reliability specs.